Remove particles from device surfaces using adhesive tape. Punch the entire device out of the PDMS using a 5-mm puncher (Harris Uni-core, Ted Pella). Punch the delivery port using a 1.2-mm punch (Harris Uni-core, Ted Pella). 6.īake and cure PDMS microfluidic device for at least 12 h in an oven set to 75 ☌. Use a vacuum desiccator for at least 1 h to degas PDMS. Mix vigorously PDMS (20 g) with curing agent (2 g) and pour carefully onto mold. Use the patterned wafer as a mold to cast polydimethylsiloxane (PDMS, Sylgard 184, Ellsworth Adhesives, Wilmington, MA) device. Pattern the wafer by sequential ultraviolet light exposure through two photolithographic masks and process according to the manufacturer's instructions. Spin-coat the silicon wafer, with a first 4-μm thick epoxy-based negative photoresist layer (SU-8, Microchem, Newton, MA) to define the migration channels and a second 45-μm epoxy layer to define the whole blood-loading chamber. 2.įabricate the master mold on a silicon wafer, in a clean room, using standard photolithographic techniques. Design a device using AutoCAD and print chrome masks for photolithography.
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